Array substrate and display panel with same

ABSTRACT

An array substrate can include a plurality of thin film transistors, a plurality of function lines, a plurality of leads, a coupling part and a driver. The plurality of function lines are configured to transmit driving signals to the thin film transistors. The plurality of leads include a first lead and a second lead. The coupling part is electrically coupling the leads to the function lines. The driver is electrically coupled to the leads, and configured to provide the driving signals to the function lines. The first lead has a length larger than that of the second lead. A contacting area between the first lead and the coupling part is larger than that between the second lead and the coupling part. A display panel with the array substrate is also provided.

FIELD

The subject matter herein generally relates to display technology, andparticularly to an array substrate and a display panel using the arraysubstrate.

BACKGROUND

Liquid crystal display panel typically includes an array substrate, acolor filter substrate, and a liquid crystal layer located between thearray substrate and the color filter substrate. It is by applyingvoltage to control torsion of liquid crystal molecules of the liquidcrystal layer to realize control of light pass rate, so as to achieve agoal of display.

BRIEF DESCRIPTION OF THE DRAWINGS

Implementations of the present technology will now be described, by wayof example only, with reference to the attached figures.

FIG. 1 is an isometric view of a display panel in accordance with anembodiment of the present disclosure.

FIG. 2 is a top view of an array substrate of the display panel in FIG.1.

FIG. 3 is a cross sectional view of the array substrate in FIG. 1 takenalong line I-I.

FIG. 4 is a diagrammatic, top view of a first data line and a first leadof the array substrate in FIG. 2.

FIG. 5 is a diagrammatic, top view of a second data line and a secondlead of the array substrate in FIG. 2.

FIG. 6 is a diagrammatic, top view of a first data line and a first leadof an alternative embodiment.

FIG. 7 is a diagrammatic, top view of a second data line and a secondlead of an alternative embodiment.

DETAILED DESCRIPTION

It will be appreciated that for simplicity and clarity of illustration,where appropriate, reference numerals have been repeated among thedifferent figures to indicate corresponding or analogous elements. Inaddition, numerous specific details are set forth in order to provide athorough understanding of the embodiments described herein. However, itwill be understood by those of ordinary skill in the art that theembodiments described herein can be practiced without these specificdetails. In other instances, methods, procedures and components have notbeen described in detail so as not to obscure the related relevantfeature being described. Also, the description is not to be consideredas limiting the scope of the embodiments described herein. The drawingsare not necessarily to scale and the proportions of certain parts may beexaggerated to better illustrate details and features of the presentdisclosure.

Several definitions that apply throughout this disclosure will now bepresented.

The term “coupled” is defined as connected, whether directly orindirectly through intervening components, and is not necessarilylimited to physical connections. The connection can be such that theobjects are permanently connected or releasably connected. The term“comprising,” when utilized, means “including, but not necessarilylimited to”; it specifically indicates open-ended inclusion ormembership in the so-described combination, group, series and the like.

The present disclosure is described in relation to an array substrate.The array substrate can include a plurality of thin film transistors, aplurality of function lines, a plurality of leads, a coupling part and adriver. The plurality of function lines are configured to transmitdriving signals to the thin film transistors. The plurality of leadsinclude a first lead and a second lead. The coupling part iselectrically coupling the leads to the function lines. The driver iselectrically coupled to the leads, and configured to provide the drivingsignals to the function lines. The first lead has a length larger thanthat of the second lead. A contacting area between the first lead andthe coupling part is larger than that between the second lead and thecoupling part.

The present disclosure is described further in relation to a displaypanel. The display panel can include an array substrate, an oppositesubstrate and a liquid crystal layer located between the array substrateand the opposite substrate. The array substrate can include a pluralityof thin film transistors, a plurality of function lines, a plurality ofleads, a coupling part and a driver. The plurality of function lines areconfigured to transmit driving signals to the thin film transistors. Theplurality of leads include a first lead and a second lead. The couplingpart is electrically coupling the leads to the function lines. Thedriver is electrically coupled to the leads, and configured to providethe driving signals to the function lines. The first lead has a lengthlarger than that of the second lead. A contacting area between the firstlead and the coupling part is larger than that between the second leadand the coupling part.

FIG. 1 illustrates a display panel 1 of an embodiment of the presentdisclosure. The display panel 1 can include an array substrate 10, anopposite substrate 20, and a liquid crystal layer 30 between the arraysubstrate 10 and the opposite substrate 20. In at least one embodiment,the opposite substrate 20 can be a colored filter-sheet substrate. Theliquid crystal layer 30 includes a plurality of liquid crystalmolecules. The array substrate 10 is configured to control appliedvoltage to control torsion of the liquid crystal molecules of the liquidcrystal layer 30 to realize control of light pass rate, so as to achievea goal of display. The opposite substrate 20 can include a plurality oflight resistances of different colors. The plurality of lightresistances can respectively let lights of different colors through,such as red light, green light, blue light and so on.

FIG. 2 illustrates that the array substrate 10 can include a displayarea 11 and a periphery area 12 around the display area 11. The displayarea 11 can include a plurality of scan lines 13 and a plurality of datalines 14 cross with the scan lines 13. The plurality of scan lines 13and the plurality of data lines 14 cooperatively form a plurality ofarray type pixel areas 15. The scan lines 13 and the data lines 14 arefunction lines of the array substrate 10 and provide electric signals tothe pixel areas 15. The scan lines 13 are electrically insulated to thedata lines 14.

The scan lines 13 and the data lines 14 can be made of metal materials,alloy material, metal oxide, metal nitride materials, metal oxidematerials or other electrically conductive materials.

Each of the scan lines 13 can be in a configuration of a single layer ora stack layer. The stack layer can be in a configuration of molybdenum(Mo)-aluminum (Al)-molybdenum (Mo).

Each of the data lines 14 can be in a configuration of a single layer ora stack layer. The stack layer can be a in a configuration of molybdenum(Mo)-aluminum (Al)-molybdenum (Mo).

Each of the pixel areas 15 can include a thin film transistor 151 and apixel electrode 152 electrically coupled to the thin film transistor151. The scan lines 13 and the data lines 14 are configured to provideelectric signals to the thin film transistors 151 of the pixel areas 15.

The thin film transistor 151 can be a bottom gate thin film transistoror a top gate thin film transistor. The thin film transistor 151 caninclude a gate electrode, a channel, a source electrode and a drainelectrode. The thin film transistor 151 is electrically coupled to onescan line 13 and one data line 14.

The pixel electrode 152 is a transparent electrode. Material of thepixel electrode 152 can be indium tin oxide, indium oxide zinc or othertransparent materials.

The periphery area 12 can include a driver 16, a plurality of couplingparts 17 and a plurality of leads 18. Each lead 18 has one end thereofelectrically coupled to the driver 16 and another end electricallycoupled to the coupling part 17. The coupling parts 17 electricallycouple the function lines to the leads 18, thereby electrically couplingthe driver 16 to the function lines. In at least one embodiment, thefunction lines are the data lines 14, the driver 16 is data driver.

In at least one embodiment, the driver 16 is adjacent to a middleportion of the array substrate 10.

The coupling parts 17 and the pixel electrodes 152 are formed by onemask etching process. Material of the coupling parts 17 is same to thatof the pixel electrodes 152.

In the illustrated embodiment, the leads 18 and the scan lines 13 areformed by one mask etching process. Material of the leads 18 is same tothat of the scan lines 13.

The leads 18 are arranged in a layout of sector. The lead 18electrically coupled to the data line 14 which is remote from the driver16 is longer than the lead 18 electrically coupled to the data line 14which is adjacent to driver 16.

In the illustrated embodiment, the data lines 14 include a first dataline 141, a second data line 142. The first data line 141 is remote fromthe driver 16. The second data line 142 is adjacent to the driver 16.

The leads 18 include a first lead 181 and a second lead 182. The firstlead 181 can be at a periphery of the layout of sector. The second lead182 can be at a middle of the layout of sector. The first lead 181 has alength larger than that of the second lead 182.

The coupling parts 171 can include a first coupling part 171 and asecond coupling part 172.

The first data line 141 is electrically coupled to the first lead 181via the first coupling part 171, and is further electrically coupled tothe driver 16 via the first lead 181. The second data line 142 iselectrically coupled to the second lead 182 via the second coupling part172, and is further electrically coupled to the driver 16 via the secondlead 182. A distance between the first data line 141 and the driver 16is larger than a distance between the second data line 141 and thedriver 16.

In at least one embodiment, the data line 14, the lead 18 and thecoupling part 17 are formed by mask etching different conductive layers.

FIG. 3 illustrates that the array substrate 10 further includes base120, a first insulating layer 130 and a second insulating layer 140. Thelead 18 is located on the base 120. The first insulating layer 130 islocated on the base 120 and covers the lead 18. The data line 14 islocated on the first insulating layer 130. The second insulating layer140 is coupled on the first insulating layer 130 and covers the dataline 14. The coupling part 17 is coupled on the second insulating layer140. The first insulating layer 130 defines a first through hole 131corresponding to the lead 18. The second insulating layer 140 defines asecond through hole 143 corresponding to the first through hole 131. Thecoupling part 17 has a portion thereof inserted into the first throughhole 131 and the second through hole 143 and electrically coupled to thelead 18. The second insulating layer 140 defines a third through hole144 corresponding to the data line 14. The coupling part 17 has anotherportion inserted into the third through hole 144 and electricallycoupled to the data line 14. Therefore, the coupling part 17electrically couples the data line 14 to the lead 18.

In the illustrated embodiment of FIG. 2, the first lead 181 has a lengthlarger than that of the second lead 182, when the driving signals aretransmitted from the driver 16 to the first data line 141 and the seconddata line 142, an impedance in the first data line 141 is higher than animpedance in second data line 142. In order to overcome that, a numberof the first through hole 131, the second through hole 143 and the thirdthrough hole 144 where the first lead 181 is coupled to the first dataline 141 via the first coupling part 171 increases, to increase couplingarea between the first lead 181 and the first coupling part 171 andcoupling area between the first data line 141 and the first couplingpart 171. Therefore, the impedance decreases when the driving signalsare transmitted from the driver 16 to the first data line 141, theimpedance in the first data line 141 is substantially equal to theimpedance in second data line 142 when the driving signals aretransmitted from the driver 16 to the first data line 141 and the seconddata line 142.

FIG. 4 to FIG. 5 illustrate that that numbers of the first through hole131, the second through hole 143 and the third through hole 144 wherethe first lead 181 is coupled to the first data line 141, are respectivemore than numbers of the first through 131, the second through hole 143and the third through hole 144 where the second lead 182 is coupled tothe second data line 142. Therefore, contacting area between the firstlead 181 and the first coupling part 171 and between the first data line141 and the first coupling part 171 is larger than contacting areabetween the second lead 182 and the second coupling part 172 and betweenthe second data line 141 and the second coupling part 172, whichrealizes the impendences are substantially same to each other when thedriving signals are transmitted from the driver 16 to all the data lines14.

FIG. 4 illustrates that the number of the first through hole 131, thesecond through hole 143 and the third through hole 144, where the firstlead 181 is coupled to the first data line 141 via the first couplingpart 171, are three, respectively. FIG. 5 illustrates that the number ofthe first through hole 131, the second through hole 143 and the thirdthrough hole 144, where the second lead 182 is coupled to the seconddata line 142 via the second coupling part 172, are one, respectively.

Numbers of the first through hole 131, the second through hole 143 andthe third through hole 144 are in proportional to the lengths of theleads 18. The longer the lead 18 is, the more the numbers of the firstthrough 131, the second through hole 143 and the third through hole 144is, to make that the impendences in all the leads 18 are substantiallysame to each other.

FIG. 6 and FIG. 7 illustrate that sizes of the first through 131, thesecond through hole 143 and the third through hole 144 where the firstlead 181 is coupled to the first data line 141, are respective largerthan sizes of the first through 131, the second through hole 143 and thethird through hole 144 where the second lead 182 is coupled to thesecond data line 142.

Therefore, contacting area between the first lead 181 and the firstcoupling part 171 and between the first data line 141 and the firstcoupling part 171 is larger than contacting area between the second lead182 and the second coupling part 172 and between the second data line141 and the second coupling part 172, which realizes the impendences aresubstantially same to each other when the driving signals aretransmitted from the driver 16 to all the data lines 14.

Sizes of the first through hole 131, the second through hole 143 and thethird through hole 144 are in proportional to the lengths of the leads18. The longer the lead 18 is, the larger the sizes of the first through131, the second through hole 143 and the third through hole 144 is, tomake that the impendences in all the leads 18 are substantially same toeach other.

The embodiments shown and described above are only examples. Even thoughnumerous characteristics and advantages of the present technology havebeen set forth in the foregoing description, together with details ofthe structure and function of the present disclosure, the disclosure isillustrative only, and changes may be made in the detail, including inmatters of shape, size and arrangement of the parts within theprinciples of the present disclosure up to, and including, the fullextent established by the broad general meaning of the terms used in theclaims.

What is claimed is:
 1. An array substrate comprising: a plurality ofthin film transistors; a plurality of function lines configured totransmit driving signals to the thin film transistors; a plurality ofleads comprising a first lead and a second lead; a plurality of couplingparts, each of the plurality of coupling parts electrically coupling toone of the plurality of function lines by one of the plurality of leads;and a driver electrically coupled to the plurality of leads, andconfigured to provide driving signals to the plurality of functionlines; wherein the first lead has a length larger than that of thesecond lead, and a contacting area between the first lead andcorresponding one of the plurality of coupling parts is larger than acontacting area between the second lead and corresponding one of theplurality of coupling parts; wherein the functions lines comprise afirst function line and a second function line; the first function lineis coupled to the first lead by corresponding one of the plurality ofcoupling parts; the second function line is coupled to the second leadby corresponding one of the plurality of coupling parts; wherein acontacting area between the first function line and corresponding one ofthe plurality of coupling parts is larger than a contacting area betweenthe second function line and corresponding one of the plurality ofcoupling parts; wherein the array substrate further comprises a base, afirst insulating layer, and a second insulating layer; wherein theplurality of leads is formed on the base; the first insulating layer isformed on the base and covers the plurality of leads; the plurality offunction lines is formed on the first insulating layer; the secondinsulating layer is formed on the first insulating layer and covers theplurality of function lines; the plurality of coupling parts is coupledto the second insulating layer.
 2. The array substrate of claim 1,wherein the first insulating layer defines a through hole correspondingto each of the plurality of leads, the second insulating layer defines asecond through hole corresponding to the first through hole, each of theplurality of coupling parts has a portion thereof inserted into thefirst through hole and the second through hole and electrically coupledto one of the plurality of leads.
 3. The array substrate of claim 2,wherein the second insulating layer defines a third through holecorresponding to each of the plurality of function lines, each of theplurality of coupling parts has another portion thereof inserted intothe third through hole and electrically coupled to one of the pluralityof function lines.
 4. The array substrate of claim 3, wherein numbers ofthe first through hole, the second through hole and the third throughhole where the first lead is electrically coupled to the first functionline, are more than that of first through hole, the second through holeand the third through hole where the second lead is electrically coupledto the second function line.
 5. The array substrate of claim 4, whereinthe numbers of the first through hole, the second through and the thirdthrough are in proportional to the lengths of the leads.
 6. The arraysubstrate of claim 3, wherein sizes of the first through hole, thesecond through hole and the third through hole where the first lead iselectrically coupled to the first function line, are larger than that offirst through hole, the second through hole and the third through holewhere the second lead is electrically coupled to the second functionline.
 7. The array substrate of claim 6, wherein the sizes of the firstthrough hole, the second through hole and the third through hole are inproportional to the lengths of the leads.
 8. The array substrate ofclaim 1, wherein the function lines are data lines, the driver is a datadriver.
 9. A display panel comprising an array substrate, an oppositesubstrate and a liquid crystal layer located between the array substrateand the opposite substrate, the array substrate comprising: a pluralityof thin film transistors; a plurality of function lines configured totransmit driving signals to the thin film transistors; a plurality ofleads comprising a first lead and a second lead; a plurality of couplingparts, each of the plurality of coupling parts electrically coupling toone of the plurality of function lines by one of the plurality of leads;and a driver electrically coupled to the plurality of leads, andconfigured to provide driving signals to the plurality of functionlines; wherein the first lead has a length larger than that of thesecond lead, a contacting area between the first lead and correspondingone of the plurality of coupling parts is larger than a contacting areabetween the second lead and corresponding one of the plurality ofcoupling parts; wherein the functions lines comprise a first functionline and a second function line; the first function line is coupled tothe first lead by corresponding one of the plurality of coupling parts;the second function line is coupled to the second lead by correspondingone of the plurality of coupling parts; wherein a contacting areabetween the first function line and corresponding one of the pluralityof coupling parts is larger than a contacting area between the secondfunction line and corresponding one of the plurality of coupling parts;wherein the array substrate further comprises a base, a first insulatinglayer and a second insulating layer; wherein the plurality of leads isformed on the base, the first insulating layer is formed on the base andcovers the plurality of leads; the plurality of function lines areformed on the first insulating layer; the second insulating layer isformed on the first insulating layer and covers the plurality offunction lines; the plurality of coupling parts is coupled to the secondinsulating layer.
 10. The display panel of claim 9, wherein the firstinsulating layer defines a through hole corresponding to the pluralityof leads, the second insulating layer defines a second through holecorresponding to the first through hole, each of the plurality ofcoupling parts has a portion thereof inserted into the first throughhole and the second through hole and electrically coupled to one of theplurality of leads.
 11. The display panel of claim 10, wherein thesecond insulating layer defines a third through hole corresponding tothe plurality of function lines, each of the plurality of coupling partshas another portion thereof inserted into the third through hole andelectrically coupled to one of the plurality of function lines.
 12. Thedisplay panel of claim 11, wherein numbers of the first through hole,the second through hole and the third through hole where the first leadis electrically coupled to the first function line, are more than thatof first through hole, the second through hole and the third throughhole where the second lead is electrically coupled to the secondfunction line.
 13. The display panel of claim 11, wherein sizes of thefirst through hole, the second through hole and the third through holewhere the first lead is electrically coupled to the first function line,are larger than that of first through hole, the second through hole andthe third through hole where the second lead is electrically coupled tothe second function line.
 14. The display panel of claim 9, wherein thefunction lines are data lines, the driver is a data driver.
 15. An arraysubstrate comprising: a plurality of thin film transistors; a pluralityof function lines, the plurality of function lines configured totransmit driving signals to the thin film transistors; a plurality ofleads, the plurality of leads comprising a first lead and a second lead;a plurality of coupling parts, each of the plurality of coupling partselectrically coupling to one of the plurality of function lines by oneof the plurality of leads; and a driver electrically coupled to theplurality of leads, and configured to provide driving signals to theplurality of function lines; wherein the first lead has a length largerthan a length of the second lead; and a contacting area between thefirst lead and corresponding one of the plurality of coupling parts islarger than a contacting area between the second lead and correspondingone of the plurality of coupling parts.